PC Engines APU 3 C2 System Board 2GB RAM - APU3C2

PC Engines APU3c2

PC Engines APU 3 C2 System Board 2GB RAM - APU3C2
PC Engines APU 3 C2 System Board 2GB RAM - APU3C2 Main Image
PC Engines APU 3 C2 System Board 2GB RAM - APU3C2 package contents

£221.99

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Manufacturer SKU: APU3c2

Manufacturer: PC Engines


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Price£184.99 EXC VAT£183.14 EXC VAT£181.29 EXC VAT£178.52 EXC VAT£175.74 EXC VATCall Us 01449 888000

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PC Engines APU 3 C2 System Board with 2GB RAM - APU3C2

The PC Engines APU 3 C3 with 2GB RAM system board is a big step up in performance and capacity from the popular ALIX series.

The APU3C2 board version is targeted at applications that require 2 3G / LTE modems. SIM sockets can be swapped under GPIO control, enabling failover between two different networks even when only one modem is used.

The APU3C2 features the option for a regular PCI express slot on the side.

Applications: Routers, firewalls, VOIP, dedicated servers, special purpose network plumbing, education tools...

In order to use mPCIe3 with 3G/4G cards you will need to enable ehci0 in Bios.

The power supply required for this board is not the same as that for the Alix/Wrap boards.

Specifications:

  • CPU: AMD Embedded G series GX-412TC, 1 GHz quad Jaguar core with 64 bit and AES-NI support, 32K data + 32K instruction cache per core, shared 2MB L2 cache.
  • DRAM: 2 GB DDR3-1333 DRAM
  • Storage: Boot from SD card (internal sdhci controller), external USB or m-SATA SSD. 1 SATA + power connector.
  • Power: 12V DC, about 6 to 12W depending on CPU load. Jack = 2.5 mm, center positive
  • Expansion: 3 miniPCI express (J14 USB or mSATA, with SIM; J15 USB only, with SIM; J16: full miniPCI express, but no SIM, intended for wifi). GPIO header, optional I2C bus, COM2 (3.3V RXD / TXD).
  • Connectivity: 3 Gigabit Ethernet channels (Intel i211AT on apu2b2, i210AT on apu2b4)
  • Firmware: CoreBoot open source system BIOS with support for iPXE and USB boot.
  • Form factor: 6 x 6" (152.4 x 152.4 mm) - same as apu1d, alix2d13 and wrap1e
  • Cooling: Cooling: Conductive cooling from the CPU and south bridge to the enclosure using a 3 mm alu heat spreader (included).

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